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SURMOUNTTM PIN Diode
Features
* * * * * * * Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance High Power Handling (Efficient Heatsinking)
MA4SPS502 V1
Absolute Maximum Ratings1 @ TA = +25 C (unless otherwise specified)
Parameter Reverse Voltage Forward Current Operating Temperature Storage Temperature Junction Temperature Dissipated Power (RF & DC) Mounting Temperature Absolute Maximum l -275 V l 600 mA -65 C to +150 C -65 C to +125 C +175 C 2W +235 C for 10 seconds
Description and Applications
This device is a silicon-glass PIN diode chip fabricated with M/A-COM's patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metalization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power (10 W C.W.) or higher incident peak power (500 W) series, shunt, or series-shunt switches. Small parasitic inductance, 0.35 nH, and excellent RC time constant, 0.22 pS, make the devices ideal for wireless TR switch and accessory switch circuits, where higher P1dB and IP3 values are required. These diodes can also be used in , T, tapered resistance, and switched-pad attenuator control circuits for 50 or 75 systems.
1. Operation of this device above any one of these parameters may cause permanent damage.
Case Style ODS-12701,2 (Topview)
Dimensions
Dim A B C D E 1
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
Inches Min. 0.058 0.026 0.004 0.020 0.013 Max. 0.062 0.030 0.006 0.022 0.015
Millimeters Min. 1.47 0.66 0.10 0.51 0.33 Max. 1.57 0.76 0.15 0.56 0.38 1. Backside metal: 0.1 micron thk. gold. 2. Shaded areas indicate bond pads.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNTTM PIN Diode
Electrical Specifications @ + 25 C
Symbol CT CT RS RS VF VR IR IR RJL TL Test Conditions -40 Volts, 1 MHz -40 Volts, 1 GHz 100 mA, 100 MHz 20 mA, 100 MHz 10 mA 10 A -200 V -40 V Steady state +10 mA / -6 mA measured at 90% voltage Units pF pF V V A nA C/W s 8 50 2.8 l -200 l Min. Typ. 0.140 0.090 1.4 2.4 0.87 l -275 l
MA4SPS502 V1
Max. 0.200
2.2 3.2 1.00
l -10 l
Handling Procedures
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized.
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Since the HMICTM glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is completed.
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface of these diodes and are removed from the active junction locations. These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb solder is recommended, with an equal temperature profile across the contacts. Conductive epoxy paste for attachment may also be used. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that its mounting pads are aligned with the circuit board's mounting pads and reflow the solder by heating the
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
Functional Schematic1
Ls
Rp
Cp
Rvia
Rvia
1. Rs = 2 * Rvia + Rp
+
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
SURMOUNTTM PIN Diode
Typical Performance Curves @ +25 C
MA4SPS502 V1
Typical Total Resistance RS vs. Forward Current and Frequency
4.0 3.5 3.0 RS (ohms) 2.5 2.0 1.5 1.0 0.5 0.0 0.00E+00 2.00E+08 4.00E+08 6.00E+08 8.00E+08 1.00E+09 FREQUENCY (Hz)
100mA
5.00E-14 2.00E-13
Typical Total Capacitance CP vs. Reverse Voltage and Frequency
0V
10mA 20mA
CP (F)
1.50E-13
500mA
1.00E-13 -40V
-5V
0.00E+00 0.0E+00
2.0E+08
4.0E+08
6.0E+08
8.0E+08
1.0E+09
FREQUENCY (Hz)
CP vs. Vr @ 100 MHz and 1 GHz
2.0E-13 100MHz 1.5E-13
1.0E+06
RP vs. Vr @ 100 MHz and 1 GHz
100MHz
1.0E-13 1GHz 5.0E-14
RP (ohms)
1.0E+05
CP (F)
1.0E+04
1GHz
0.0E+00 0 5 10 15 20 25 30 35 40
1.0E+03 0 10 20 30 40
Vr (V)
V r (V)
RS vs. IF @ 100 MHz and 1 GHz
10
LS vs. Frequency @ 10 mA
1.0E-08
RS (ohms)
1GHz
Ls (H)
1.0E-09
100MHz
1 0.001 0.010 0.100
1.0E-10 5.00E+08
7.00E+08
9.00E+08
1.10E+09
1.30E+09
1.50E+09
1.70E+09
If (A)
FREQUENCY (Hz)
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.
3
SURMOUNTTM PIN Diode
MA4SPS502 SPICE Model
MA4SPS502 V1
PinDiodeModel NLPINM1 Is=1.0E-14 A Vi=0.0 V Un=900 cm^2/V-sec Wi=40 um Rr=20 K Ohm Cmin=0.12 pF Tau=2.8 usec Rs=0.1 Ohm Cj0=0.18 pF Vj=0.7 V M=0.5 Fc=0.5 Imax=2.5E+7 A/m^2 Kf=0.0 Af=1.0
wBv=200 V wPmax=2.0 W Ffe=1.0
MA4SPS502 Schematic
Ls
Cp Rp
Rvia
Rvia
_
Notes :
Rs = 2 * Rvia + Rp
+
4
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. M/A-COM makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does M/A-COM assume any liability whatsoever arising out of the use or application of any product(s) or information.
* North America Tel: 800.366.2266 / Fax: 978.366.2266 * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macom.com for additional data sheets and product information.

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